TY  - INPR
ID  - SisLab4430
UR  - https://ieeexplore.ieee.org/document/9388872
A1  - Dang, Nam Khanh
A1  - Ahmed, Akram Ben
A1  - Abdallah, Abderazek Ben
A1  - Tran, Xuan Tu
Y1  - 2021/03/31/
N2  - Through Silicon Via (TSV) is considered as the
near-future solution to realize low-power and high-performance
3D-Integrated Circuits (3D-ICs) and 3D-Network-on-Chips (3DNoCs). However, the lifetime reliability issue of TSV due to
its fault sensitivity and the high operating temperature of
3D-ICs, which also accelerates the fault-rate, is one of the
most critical challenges. Meanwhile, most current works focus
on detecting and correcting TSV defects after manufacturing
without considering high-temperature nodes? impact on lifetime
reliability. Besides, the recovery for defective clusters is also
challenging because of costly redundancies. In this work, we
present HotCluster: a hotspot-aware self-correction platform for
clustering defects in 3D-NoCs to help understand and tackle
this problem. We first give a method to predict normalized fault
rates and place redundant TSV groups according to each region?s
fault rate. In our particular medium fault-rate (normalized to the
coolest area), HotCluster reduces about 60% of the redundancies
in comparison to the uniformly distributed redundancies while
having a higher ratio of router working in a normal state. Furthermore, HotCluster integrates both online (weight-based) and
offline (max-flow min-cut offline method) mapping algorithms to
help the system correct the faulty TSV clusters. The experimental
results show that both the max-flow min-cut offline method and
weight-based online mode with a redundancy of 0.25 exhibits less
than 1% of routers disabled under 50% defect-rates.
PB  - IEEE
JF  - IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
SN  - 0278-0070
TI  - HotCluster: A thermal-aware defect recovery
method for Through-Silicon-Vias Towards Reliable
3-D ICs systems
AV  - restricted
ER  -