eprintid: 4430
rev_number: 10
eprint_status: archive
userid: 375
dir: disk0/00/00/44/30
datestamp: 2021-05-31 10:52:11
lastmod: 2021-05-31 10:52:11
status_changed: 2021-05-31 10:52:11
type: article
metadata_visibility: show
creators_name: Dang, Nam Khanh
creators_name: Ahmed, Akram Ben
creators_name: Abdallah, Abderazek Ben
creators_name: Tran, Xuan Tu
creators_id: dnk0904@gmail.com
creators_id: benab@u-aizu.ac.jp
creators_id: tutx@vnu.edu.vn
title: HotCluster: A thermal-aware defect recovery
method for Through-Silicon-Vias Towards Reliable
3-D ICs systems
ispublished: inpress
subjects: ECE
subjects: ElectronicsandComputerEngineering
subjects: isi
divisions: lab_sis
abstract: Through Silicon Via (TSV) is considered as the
near-future solution to realize low-power and high-performance
3D-Integrated Circuits (3D-ICs) and 3D-Network-on-Chips (3DNoCs). However, the lifetime reliability issue of TSV due to
its fault sensitivity and the high operating temperature of
3D-ICs, which also accelerates the fault-rate, is one of the
most critical challenges. Meanwhile, most current works focus
on detecting and correcting TSV defects after manufacturing
without considering high-temperature nodes’ impact on lifetime
reliability. Besides, the recovery for defective clusters is also
challenging because of costly redundancies. In this work, we
present HotCluster: a hotspot-aware self-correction platform for
clustering defects in 3D-NoCs to help understand and tackle
this problem. We first give a method to predict normalized fault
rates and place redundant TSV groups according to each region’s
fault rate. In our particular medium fault-rate (normalized to the
coolest area), HotCluster reduces about 60% of the redundancies
in comparison to the uniformly distributed redundancies while
having a higher ratio of router working in a normal state. Furthermore, HotCluster integrates both online (weight-based) and
offline (max-flow min-cut offline method) mapping algorithms to
help the system correct the faulty TSV clusters. The experimental
results show that both the max-flow min-cut offline method and
weight-based online mode with a redundancy of 0.25 exhibits less
than 1% of routers disabled under 50% defect-rates.
date: 2021-03-31
date_type: published
publisher: IEEE
official_url: https://ieeexplore.ieee.org/document/9388872
full_text_status: restricted
publication: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
refereed: TRUE
issn: 0278-0070
funders: NAFOSTED
citation:   Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu  (2021) HotCluster: A thermal-aware defect recovery method for Through-Silicon-Vias Towards Reliable 3-D ICs systems.  IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems .    ISSN 0278-0070    (In Press)  
document_url: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/4430/1/09388872.pdf