?url_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.au=Bui%2C+Thanh+Tung&rft.aulast=Bui&rft.aufirst=Thanh+Tung&rft.issue=4S&rft.volume=52&rft.date=April+2013&rft.issn=0021-4922&rft.atitle=Sub-Micron-Accuracy+Gold-to-Gold+Interconnection+Flip-Chip+Bonding+Approach+for+Electronics%E2%80%93Optics+Heterogeneous+Integration&rft.title=Japanese+Journal+of+Applied+Physics&rft.pages=04CB08&rft.genre=article