relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/837/
title: Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration
creator: Bui, Thanh Tung
creator: Suzuki, Motohiro
creator: Kato, Fumiki
creator: Nemoto, Shunsuke
creator: Watanabe, Naoki
creator: Aoyagi, Masahiro
subject: Electronics and Communications
subject: Electronics and Computer Engineering
date: 2013-04
type: Article
type: PeerReviewed
identifier:   Bui, Thanh Tung and Suzuki, Motohiro and Kato, Fumiki and Nemoto, Shunsuke and Watanabe, Naoki and Aoyagi, Masahiro  (2013) Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration.  Japanese Journal of Applied Physics, 52  (4S).   04CB08.  ISSN 0021-4922     
relation: http://dx.doi.org/10.7567/JJAP.52.04CB08