%0 Journal Article
%@ 0021-4922
%A Bui, Thanh Tung
%A Suzuki, Motohiro
%A Kato, Fumiki
%A Nemoto, Shunsuke
%A Watanabe, Naoki
%A Aoyagi, Masahiro
%D 2013
%F SisLab:837
%J Japanese Journal of Applied Physics
%N 4S
%P 04CB08
%T Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration
%U https://eprints.uet.vnu.edu.vn/eprints/id/eprint/837/
%V 52