<> "The repository administrator has not yet configured an RDF license."^^ . <> . . . "Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration"^^ . "2013-04" . "52" . "4S" . . "Japanese Journal of Applied Physics"^^ . . . "00214922" . . . . . . . . . . . . . . . . . . . . . . "Shunsuke"^^ . "Nemoto"^^ . "Shunsuke Nemoto"^^ . . "Masahiro"^^ . "Aoyagi"^^ . "Masahiro Aoyagi"^^ . . "Motohiro"^^ . "Suzuki"^^ . "Motohiro Suzuki"^^ . . "Thanh Tung"^^ . "Bui"^^ . "Thanh Tung Bui"^^ . . "Naoki"^^ . "Watanabe"^^ . "Naoki Watanabe"^^ . . "Fumiki"^^ . "Kato"^^ . "Fumiki Kato"^^ . . . . . "HTML Summary of #837 \n\nSub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration\n\n" . "text/html" . . . "Electronics and Communications"@en . . . "Electronics and Computer Engineering"@en . .