TY  - JOUR
ID  - SisLab837
UR  - http://dx.doi.org/10.7567/JJAP.52.04CB08
IS  - 4S
A1  - Bui, Thanh Tung
A1  - Suzuki, Motohiro
A1  - Kato, Fumiki
A1  - Nemoto, Shunsuke
A1  - Watanabe, Naoki
A1  - Aoyagi, Masahiro
Y1  - 2013/04//
JF  - Japanese Journal of Applied Physics
VL  - 52
SN  - 0021-4922
TI  - Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics?Optics Heterogeneous Integration
AV  - none
ER  -