eprintid: 837
rev_number: 7
eprint_status: archive
userid: 5
dir: disk0/00/00/08/37
datestamp: 2016-05-30 05:41:41
lastmod: 2016-05-30 05:42:28
status_changed: 2016-05-30 05:41:41
type: article
metadata_visibility: show
creators_name: Bui, Thanh Tung
creators_name: Suzuki, Motohiro
creators_name: Kato, Fumiki
creators_name: Nemoto, Shunsuke
creators_name: Watanabe, Naoki
creators_name: Aoyagi, Masahiro
creators_id: tungbt@vnu.edu.vn
title: Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration
ispublished: pub
subjects: ECE
subjects: ElectronicsandComputerEngineering
divisions: fac_fet
date: 2013-04
date_type: published
official_url: http://dx.doi.org/10.7567/JJAP.52.04CB08
full_text_status: none
publication: Japanese Journal of Applied Physics
volume: 52
number: 4S
pagerange: 04CB08
refereed: TRUE
issn: 0021-4922
citation:   Bui, Thanh Tung and Suzuki, Motohiro and Kato, Fumiki and Nemoto, Shunsuke and Watanabe, Naoki and Aoyagi, Masahiro  (2013) Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration.  Japanese Journal of Applied Physics, 52  (4S).   04CB08.  ISSN 0021-4922