@inproceedings{SisLab839,
       booktitle = {2013 IEEE Electronic Components and Technology Conference},
           month = {May},
           title = {Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications},
          author = {Thanh Tung Bui and Motohiro Suzuki and Fumiki Kato and Naoya Watanabe and Shunsuke Nemoto and Katsuya Kikuchi and Masahiro Aoyagi},
       publisher = {IEEE},
            year = {2013},
           pages = {425--430},
             url = {https://eprints.uet.vnu.edu.vn/eprints/id/eprint/839/}
}