?url_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.au=Bui%2C+Thanh+Tung&rft.aulast=Bui&rft.aufirst=Thanh+Tung&rft.date=May+2013&rft.title=Modified+thermosonic+flip-chip+bonding+based+on+electroplated+Cu+microbumps+and+concave+pads+for+high-precision+low-temperature+assembly+applications&rft.genre=proceeding