relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/839/
title: Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications
creator: Bui, Thanh Tung
creator: Suzuki, Motohiro
creator: Kato, Fumiki
creator: Watanabe, Naoya
creator: Nemoto, Shunsuke
creator: Kikuchi, Katsuya
creator: Aoyagi, Masahiro
subject: Electronics and Communications
subject: Electronics and Computer Engineering
publisher: IEEE
date: 2013-05
type: Conference or Workshop Item
type: PeerReviewed
identifier:   Bui, Thanh Tung and Suzuki, Motohiro and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro  (2013) Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications.  In: 2013 IEEE Electronic Components and Technology Conference, 2013, Las Vegas, USA.     
relation: http://dx.doi.org/10.1109/ECTC.2013.6575606