%0 Conference Paper
%A Bui, Thanh Tung
%A Suzuki, Motohiro
%A Kato, Fumiki
%A Watanabe, Naoya
%A Nemoto, Shunsuke
%A Kikuchi, Katsuya
%A Aoyagi, Masahiro
%B 2013 IEEE Electronic Components and Technology Conference
%C Las Vegas, USA
%D 2013
%F SisLab:839
%I IEEE
%P 425-430
%T Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications
%U https://eprints.uet.vnu.edu.vn/eprints/id/eprint/839/