<> "The repository administrator has not yet configured an RDF license."^^ . <> . . . "Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications"^^ . "2013-05" . . "IEEE"^^ . . . . . . . . . . . . . . . . . . . . . . . . . . "Masahiro"^^ . "Aoyagi"^^ . "Masahiro Aoyagi"^^ . . "Naoya"^^ . "Watanabe"^^ . "Naoya Watanabe"^^ . . "Thanh Tung"^^ . "Bui"^^ . "Thanh Tung Bui"^^ . . "Shunsuke"^^ . "Nemoto"^^ . "Shunsuke Nemoto"^^ . . "Motohiro"^^ . "Suzuki"^^ . "Motohiro Suzuki"^^ . . "Katsuya"^^ . "Kikuchi"^^ . "Katsuya Kikuchi"^^ . . "Fumiki"^^ . "Kato"^^ . "Fumiki Kato"^^ . . . . "2013 IEEE Electronic Components and Technology Conference"^^ . . . . . "Las Vegas, USA"^^ . . . . . "HTML Summary of #839 \n\nModified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications\n\n" . "text/html" . . . "Electronics and Communications"@en . . . "Electronics and Computer Engineering"@en . .