TY  - CONF
ID  - SisLab839
UR  - http://dx.doi.org/10.1109/ECTC.2013.6575606
A1  - Bui, Thanh Tung
A1  - Suzuki, Motohiro
A1  - Kato, Fumiki
A1  - Watanabe, Naoya
A1  - Nemoto, Shunsuke
A1  - Kikuchi, Katsuya
A1  - Aoyagi, Masahiro
Y1  - 2013/05//
PB  - IEEE
TI  - Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications
SP  - 425
M2  - Las Vegas, USA
AV  - none
EP  - 430
T2  - 2013 IEEE Electronic Components and Technology Conference
ER  -