%A Thanh Tung Bui
%A Motohiro Suzuki
%A Fumiki Kato
%A Naoya Watanabe
%A Shunsuke Nemoto
%A Katsuya Kikuchi
%A Masahiro Aoyagi
%T Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications
%C Las Vegas, USA
%D 2013
%I IEEE
%P 425-430
%L SisLab839