eprintid: 839
rev_number: 7
eprint_status: archive
userid: 5
dir: disk0/00/00/08/39
datestamp: 2016-05-30 05:44:00
lastmod: 2016-05-30 05:44:29
status_changed: 2016-05-30 05:44:00
type: conference_item
metadata_visibility: show
creators_name: Bui, Thanh Tung
creators_name: Suzuki, Motohiro
creators_name: Kato, Fumiki
creators_name: Watanabe, Naoya
creators_name: Nemoto, Shunsuke
creators_name: Kikuchi, Katsuya
creators_name: Aoyagi, Masahiro
creators_id: tungbt@vnu.edu.vn
title: Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications
ispublished: pub
subjects: ECE
subjects: ElectronicsandComputerEngineering
divisions: fac_fet
date: 2013-05
date_type: published
publisher: IEEE
official_url: http://dx.doi.org/10.1109/ECTC.2013.6575606
full_text_status: none
pres_type: paper
pagerange: 425-430
event_title: 2013 IEEE Electronic Components and Technology Conference
event_location: Las Vegas, USA
event_dates: 2013
event_type: conference
refereed: TRUE
citation:   Bui, Thanh Tung and Suzuki, Motohiro and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro  (2013) Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications.  In: 2013 IEEE Electronic Components and Technology Conference, 2013, Las Vegas, USA.