@inproceedings{SisLab840,
       booktitle = {International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices},
           month = {July},
           title = {High Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects},
          author = {Thanh Tung Bui and Suzuki Motohiro and Watanabe Naoya and Kikuchi Katsuya and Kato Fumiki and Nemoto Shunsuke and Masahiro Aoyagi},
            year = {2013},
             url = {https://eprints.uet.vnu.edu.vn/eprints/id/eprint/840/}
}