relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/840/
title: High Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects
creator: Bui, Thanh Tung
creator: Motohiro, Suzuki
creator: Naoya, Watanabe
creator: Katsuya, Kikuchi
creator: Fumiki, Kato
creator: Shunsuke, Nemoto
creator: Aoyagi, Masahiro
subject: Electronics and Communications
subject: Electronics and Computer Engineering
date: 2013-07
type: Conference or Workshop Item
type: PeerReviewed
identifier:   Bui, Thanh Tung and Motohiro, Suzuki and Naoya, Watanabe and Katsuya, Kikuchi and Fumiki, Kato and Shunsuke, Nemoto and Aoyagi, Masahiro  (2013) High Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects.  In: International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices, July 2013, Zweibrucken, Germany.