%0 Conference Paper
%A Bui, Thanh Tung
%A Motohiro, Suzuki
%A Naoya, Watanabe
%A Katsuya, Kikuchi
%A Fumiki, Kato
%A Shunsuke, Nemoto
%A Aoyagi, Masahiro
%B International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices
%C Zweibrucken, Germany
%D 2013
%F SisLab:840
%T High Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects
%U https://eprints.uet.vnu.edu.vn/eprints/id/eprint/840/