<> "The repository administrator has not yet configured an RDF license."^^ . <> . . . "High Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects"^^ . "2013-07" . . . . . . . . . . . . . . . . . . . . . . . . . "Nemoto"^^ . "Shunsuke"^^ . "Nemoto Shunsuke"^^ . . "Masahiro"^^ . "Aoyagi"^^ . "Masahiro Aoyagi"^^ . . "Thanh Tung"^^ . "Bui"^^ . "Thanh Tung Bui"^^ . . "Watanabe"^^ . "Naoya"^^ . "Watanabe Naoya"^^ . . "Suzuki"^^ . "Motohiro"^^ . "Suzuki Motohiro"^^ . . "Kato"^^ . "Fumiki"^^ . "Kato Fumiki"^^ . . "Kikuchi"^^ . "Katsuya"^^ . "Kikuchi Katsuya"^^ . . . . "International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices"^^ . . . . . "Zweibrucken, Germany"^^ . . . . . "HTML Summary of #840 \n\nHigh Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects\n\n" . "text/html" . . . "Electronics and Communications"@en . . . "Electronics and Computer Engineering"@en . .