TY  - CONF
ID  - SisLab840
UR  - https://eprints.uet.vnu.edu.vn/eprints/id/eprint/840/
A1  - Bui, Thanh Tung
A1  - Motohiro, Suzuki
A1  - Naoya, Watanabe
A1  - Katsuya, Kikuchi
A1  - Fumiki, Kato
A1  - Shunsuke, Nemoto
A1  - Aoyagi, Masahiro
Y1  - 2013/07//
TI  - High Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects
AV  - none
M2  - Zweibrucken, Germany
T2  - International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices
ER  -