%A Thanh Tung Bui
%A Suzuki Motohiro
%A Watanabe Naoya
%A Kikuchi Katsuya
%A Kato Fumiki
%A Nemoto Shunsuke
%A Masahiro Aoyagi
%T High Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects
%C Zweibrucken, Germany
%D 2013
%L SisLab840