eprintid: 840
rev_number: 7
eprint_status: archive
userid: 5
dir: disk0/00/00/08/40
datestamp: 2016-05-30 05:44:40
lastmod: 2016-05-30 05:45:31
status_changed: 2016-05-30 05:44:40
type: conference_item
metadata_visibility: show
creators_name: Bui, Thanh Tung
creators_name: Motohiro, Suzuki
creators_name: Naoya, Watanabe
creators_name: Katsuya, Kikuchi
creators_name: Fumiki, Kato
creators_name: Shunsuke, Nemoto
creators_name: Aoyagi, Masahiro
creators_id: tungbt@vnu.edu.vn
title: High Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects
ispublished: pub
subjects: ECE
subjects: ElectronicsandComputerEngineering
divisions: fac_fet
date: 2013-07
date_type: published
full_text_status: none
pres_type: paper
event_title: International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices
event_location: Zweibrucken, Germany
event_dates: July 2013
event_type: conference
refereed: TRUE
citation:   Bui, Thanh Tung and Motohiro, Suzuki and Naoya, Watanabe and Katsuya, Kikuchi and Fumiki, Kato and Shunsuke, Nemoto and Aoyagi, Masahiro  (2013) High Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects.  In: International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices, July 2013, Zweibrucken, Germany.