@inproceedings{SisLab841,
       booktitle = {International Conference on Solid State Devices and Materials},
           title = {15-{\ensuremath{\mu}}m-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications},
          author = {Thanh Tung Bui and Fumiki Kato and Naoya Watanabe and Shunsuke Nemoto and Katsuya Kikuchi and Masahiro Aoyagi},
            year = {2013},
             url = {https://eprints.uet.vnu.edu.vn/eprints/id/eprint/841/}
}