?url_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.au=Bui%2C+Thanh+Tung&rft.aulast=Bui&rft.aufirst=Thanh+Tung&rft.date=2013&rft.title=15-%CE%BCm-pitch+Cu%2FAu+Interconnections+Relied+on+Self-aligned+Low-temperature+Thermosonic+Flip-chip+Bonding+Technique+for+A+dvanced+Chip+Stacking+Applications&rft.genre=proceeding