relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/841/
title: 15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications
creator: Bui, Thanh Tung
creator: Kato, Fumiki
creator: Watanabe, Naoya
creator: Nemoto, Shunsuke
creator: Kikuchi, Katsuya
creator: Aoyagi, Masahiro
subject: Electronics and Communications
subject: Electronics and Computer Engineering
date: 2013
type: Conference or Workshop Item
type: PeerReviewed
identifier:   Bui, Thanh Tung and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro  (2013) 15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications.  In: International Conference on Solid State Devices and Materials, 2013, Fukuoka, Japan.