%0 Conference Paper
%A Bui, Thanh Tung
%A Kato, Fumiki
%A Watanabe, Naoya
%A Nemoto, Shunsuke
%A Kikuchi, Katsuya
%A Aoyagi, Masahiro
%B International Conference on Solid State Devices and Materials
%C Fukuoka, Japan
%D 2013
%F SisLab:841
%T 15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications
%U https://eprints.uet.vnu.edu.vn/eprints/id/eprint/841/