<> "The repository administrator has not yet configured an RDF license."^^ . <> . . . "15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications"^^ . "2013" . . . . . . . . . . . . . . . . . . . . . . "Masahiro"^^ . "Aoyagi"^^ . "Masahiro Aoyagi"^^ . . "Naoya"^^ . "Watanabe"^^ . "Naoya Watanabe"^^ . . "Fumiki"^^ . "Kato"^^ . "Fumiki Kato"^^ . . "Thanh Tung"^^ . "Bui"^^ . "Thanh Tung Bui"^^ . . "Katsuya"^^ . "Kikuchi"^^ . "Katsuya Kikuchi"^^ . . "Shunsuke"^^ . "Nemoto"^^ . "Shunsuke Nemoto"^^ . . . . "International Conference on Solid State Devices and Materials"^^ . . . . . "Fukuoka, Japan"^^ . . . . . "HTML Summary of #841 \n\n15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications\n\n" . "text/html" . . . "Electronics and Communications"@en . . . "Electronics and Computer Engineering"@en . .