TY  - CONF
ID  - SisLab841
UR  - https://eprints.uet.vnu.edu.vn/eprints/id/eprint/841/
A1  - Bui, Thanh Tung
A1  - Kato, Fumiki
A1  - Watanabe, Naoya
A1  - Nemoto, Shunsuke
A1  - Kikuchi, Katsuya
A1  - Aoyagi, Masahiro
Y1  - 2013///
TI  - 15-?m-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications
AV  - none
M2  - Fukuoka, Japan
T2  - International Conference on Solid State Devices and Materials
ER  -