%A Thanh Tung Bui
%A Fumiki Kato
%A Naoya Watanabe
%A Shunsuke Nemoto
%A Katsuya Kikuchi
%A Masahiro Aoyagi
%T 15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications
%C Fukuoka, Japan
%D 2013
%L SisLab841