eprintid: 841
rev_number: 8
eprint_status: archive
userid: 5
dir: disk0/00/00/08/41
datestamp: 2016-05-30 05:28:54
lastmod: 2016-05-30 05:29:57
status_changed: 2016-05-30 05:28:54
type: conference_item
metadata_visibility: show
creators_name: Bui, Thanh Tung
creators_name: Kato, Fumiki
creators_name: Watanabe, Naoya
creators_name: Nemoto, Shunsuke
creators_name: Kikuchi, Katsuya
creators_name: Aoyagi, Masahiro
creators_id: tungbt@vnu.edu.vn
title: 15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications
ispublished: pub
subjects: ECE
subjects: ElectronicsandComputerEngineering
divisions: fac_fet
date: 2013
date_type: published
full_text_status: none
pres_type: paper
event_title: International Conference on Solid State Devices and Materials
event_location: Fukuoka, Japan
event_dates: 2013
event_type: conference
refereed: TRUE
citation:   Bui, Thanh Tung and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro  (2013) 15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications.  In: International Conference on Solid State Devices and Materials, 2013, Fukuoka, Japan.