relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/842/
title: Investigation of the applicability of parylene-HT as a dielectric layer for interconnections in 3D integration system
creator: Bui, Thanh Tung
creator: Watanabe, Naoya
creator: Cheng, Xiaojin
creator: Kato, Fumiki
creator: Kikuchi, Katsuya
creator: Aoyagi, Masahiro
subject: Electronics and Communications
subject: Electronics and Computer Engineering
date: 2013-11
type: Conference or Workshop Item
type: PeerReviewed
identifier:   Bui, Thanh Tung and Watanabe, Naoya and Cheng, Xiaojin and Kato, Fumiki and Kikuchi, Katsuya and Aoyagi, Masahiro  (2013) Investigation of the applicability of parylene-HT as a dielectric layer for interconnections in 3D integration system.  In: International Symposium on Frontiers of Materials Science, November 2013, Hanoi, Vietnam.