%0 Conference Paper
%A Bui, Thanh Tung
%A Watanabe, Naoya
%A Cheng, Xiaojin
%A Kato, Fumiki
%A Kikuchi, Katsuya
%A Aoyagi, Masahiro
%B International Symposium on Frontiers of Materials Science
%C Hanoi, Vietnam
%D 2013
%F SisLab:842
%T Investigation of the applicability of parylene-HT as a dielectric layer for interconnections in 3D integration system
%U https://eprints.uet.vnu.edu.vn/eprints/id/eprint/842/