eprintid: 842
rev_number: 9
eprint_status: archive
userid: 5
dir: disk0/00/00/08/42
datestamp: 2016-05-30 05:45:42
lastmod: 2016-05-30 05:46:45
status_changed: 2016-05-30 05:45:42
type: conference_item
metadata_visibility: show
creators_name: Bui, Thanh Tung
creators_name: Watanabe, Naoya
creators_name: Cheng, Xiaojin
creators_name: Kato, Fumiki
creators_name: Kikuchi, Katsuya
creators_name: Aoyagi, Masahiro
creators_id: tungbt@vnu.edu.vn
title: Investigation of the applicability of parylene-HT as a dielectric layer for interconnections in 3D integration system
ispublished: pub
subjects: ECE
subjects: ElectronicsandComputerEngineering
divisions: fac_fet
date: 2013-11
date_type: published
full_text_status: none
pres_type: paper
event_title: International Symposium on Frontiers of Materials Science
event_location: Hanoi, Vietnam
event_dates: November 2013
event_type: conference
refereed: TRUE
citation:   Bui, Thanh Tung and Watanabe, Naoya and Cheng, Xiaojin and Kato, Fumiki and Kikuchi, Katsuya and Aoyagi, Masahiro  (2013) Investigation of the applicability of parylene-HT as a dielectric layer for interconnections in 3D integration system.  In: International Symposium on Frontiers of Materials Science, November 2013, Hanoi, Vietnam.