relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/844/
title: Investigation of a Microchannel-based Cooling Interposer for High-Performance Memory-on-Logic 3DIC Designg
creator: Melamed, Samson
creator: Hashino, Masaru
creator: Fumiki, Kato
creator: Shunsuke, Nemoto
creator: Bui, Thanh Tung
creator: Katsuya, Kikuchi
creator: Hiroshi, Nakagawa
subject: Electronics and Communications
subject: Electronics and Computer Engineering
date: 2013
type: Conference or Workshop Item
type: PeerReviewed
identifier:   Melamed, Samson and Hashino, Masaru and Fumiki, Kato and Shunsuke, Nemoto and Bui, Thanh Tung and Katsuya, Kikuchi and Hiroshi, Nakagawa  (2013) Investigation of a Microchannel-based Cooling Interposer for High-Performance Memory-on-Logic 3DIC Designg.  In: The 15th Electronics Packaging Technology Conference, 2013, Singapore.