%0 Conference Paper
%A Melamed, Samson
%A Hashino, Masaru
%A Fumiki, Kato
%A Shunsuke, Nemoto
%A Bui, Thanh Tung
%A Katsuya, Kikuchi
%A Hiroshi, Nakagawa
%B The 15th Electronics Packaging Technology Conference
%C Singapore
%D 2013
%F SisLab:844
%T Investigation of a Microchannel-based Cooling Interposer for High-Performance Memory-on-Logic 3DIC Designg
%U https://eprints.uet.vnu.edu.vn/eprints/id/eprint/844/