TY  - CONF
ID  - SisLab844
UR  - https://eprints.uet.vnu.edu.vn/eprints/id/eprint/844/
A1  - Melamed, Samson
A1  - Hashino, Masaru
A1  - Fumiki, Kato
A1  - Shunsuke, Nemoto
A1  - Bui, Thanh Tung
A1  - Katsuya, Kikuchi
A1  - Hiroshi, Nakagawa
Y1  - 2013///
TI  - Investigation of a Microchannel-based Cooling Interposer for High-Performance Memory-on-Logic 3DIC Designg
AV  - none
M2  - Singapore
T2  - The 15th Electronics Packaging Technology Conference
ER  -