eprintid: 844
rev_number: 7
eprint_status: archive
userid: 5
dir: disk0/00/00/08/44
datestamp: 2016-05-30 07:00:10
lastmod: 2016-05-30 07:00:10
status_changed: 2016-05-30 07:00:10
type: conference_item
metadata_visibility: show
creators_name: Melamed, Samson
creators_name: Hashino, Masaru
creators_name: Fumiki, Kato
creators_name: Shunsuke, Nemoto
creators_name: Bui, Thanh Tung
creators_name: Katsuya, Kikuchi
creators_name: Hiroshi, Nakagawa
creators_id: tungbt@vnu.edu.vn
title: Investigation of a Microchannel-based Cooling Interposer for High-Performance Memory-on-Logic 3DIC Designg
ispublished: pub
subjects: ECE
subjects: ElectronicsandComputerEngineering
divisions: fac_fet
date: 2013
date_type: published
full_text_status: none
pres_type: paper
event_title: The 15th Electronics Packaging Technology Conference
event_location: Singapore
event_dates: 2013
event_type: conference
refereed: TRUE
citation:   Melamed, Samson and Hashino, Masaru and Fumiki, Kato and Shunsuke, Nemoto and Bui, Thanh Tung and Katsuya, Kikuchi and Hiroshi, Nakagawa  (2013) Investigation of a Microchannel-based Cooling Interposer for High-Performance Memory-on-Logic 3DIC Designg.  In: The 15th Electronics Packaging Technology Conference, 2013, Singapore.