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Dang, Nam Khanh and Ahmed, Akram Ben and Rokhani, Fakhrul Zaman and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs. In: 2020 International Conference On Advanced Technologies for Communications (ATC), 8-10 October 2020, Nha Trang.
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