Bui, Thanh Tung and Cheng, Xiaojin and Watanabe, Naoya and Kato, Fumiki and Kikuchi, Katsuya and Aoyagi, Masahiro (2016) A Prospective Low-k Insulator for Via-Last through-Silicon-Vias (TSVs) in 3D Integration. In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016.
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Official URL: http://doi.org/10.1109/ECTC.2016.344
| Item Type: | Conference or Workshop Item (Poster) |
|---|---|
| Subjects: | Electronics and Communications |
| Divisions: | Faculty of Electronics and Telecommunications (FET) |
| Depositing User: | Bùi Thanh Tùng |
| Date Deposited: | 28 Dec 2016 14:40 |
| Last Modified: | 28 Dec 2016 14:40 |
| URI: | http://eprints.uet.vnu.edu.vn/eprints/id/eprint/2326 |
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