Nguyen, Phuong Hoai Nam (2018) The modification of the curing properties of Bis phenol F epoxy resin by nanosilica SiO2. Technical Report. VNU University of Engineering and Technology. (In Press)
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Abstract
The modification of nanosilica SiO2 to the curing of Bis phenol F epoxy resin (epoxy F) by triethyl tetraamine (TETA) was characterized. The curing properties of the nanocomposite epoxy F:SiO2 membranes are better than Bis phenol F epoxy films. With the content from 0,1 to 0,3% of SiO2 the films epoxy F:SiO2 show the excellent curing properties which get higher 96% of the gelation. The quantum size effect of nanosilica SiO2 was also discussed.
| Item Type: | Technical Report (Technical Report) |
|---|---|
| Subjects: | Engineering Physics |
| Divisions: | Faculty of Engineering Physics and Nanotechnology (FEPN) |
| Depositing User: | Nguy�n Phương Hoà i Nam |
| Date Deposited: | 14 Dec 2018 01:39 |
| Last Modified: | 21 Dec 2018 01:12 |
| URI: | http://eprints.uet.vnu.edu.vn/eprints/id/eprint/3244 |
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