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2D Parity Product Code for TSV Online Fault Correction and Detection

Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) 2D Parity Product Code for TSV Online Fault Correction and Detection. REV Journal on Electronics and Communications, 10 (1-2). pp. 11-21.

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Abstract

Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs).However, the reliability issues due to the low yield rates and the sensitivity to thermal hotspots and stress issues arepreventing TSV-based 3D-ICs from being widely and efficiently used. To enhance the reliability of TSV connections, usingerror correction code to detect and correct faults automatically has been demonstrated as a viable solution. This paperpresents a 2D Parity Product Code (2D-PPC) for TSV fault-tolerance with the ability to correct one fault and detect, at least,two faults. In an implementation of 64-bit data and 81-bit code-word, 2D-PPC can detect over 71 faults, on average. Itsencoder and decoder decrease the overall latency by 38.33% when compared to the Single Error Correction Double ErrorDetection code. In addition to the high detection rates, the encoder can detect 100% of its gate failures, and the decodercan detect and correct around 40% of its individual gate failures. The squared 2D-PPC could be extended using orthogonalLatin square to support extra bit correction

Item Type: Article
Subjects: Electronics and Communications
Electronics and Communications > Electronics and Computer Engineering
Information Technology (IT)
Divisions: Key Laboratory for Smart Integrated Systems (SISLAB)
Depositing User: Khanh N. Dang
Date Deposited: 04 May 2020 03:38
Last Modified: 04 May 2020 03:38
URI: http://eprints.uet.vnu.edu.vn/eprints/id/eprint/3947

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