Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) Thermal distribution and reliability prediction for 3D Networks-on-Chip. VNU Journal of Computer Science and Communication Engineering . ISSN 0866-8612
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| Item Type: | Article |
|---|---|
| Subjects: | Electronics and Communications Electronics and Communications > Electronics and Computer Engineering |
| Divisions: | Key Laboratory for Smart Integrated Systems (SISLAB) |
| Depositing User: | Khanh N. Dang |
| Date Deposited: | 05 Jun 2020 02:03 |
| Last Modified: | 05 Jun 2020 02:03 |
| URI: | http://eprints.uet.vnu.edu.vn/eprints/id/eprint/3960 |
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