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TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 28 (3). pp. 672-685. ISSN 1063-8210

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In order to detect and localize TSV failures in both manufacturing and operating phases, most of the existing methods use a dedicated testing mechanism with long response time and prerequisite interruptions for on-line testing. This paper presents an ECC-based method named “Through-Silicon-Via On Communication Test” (TSV-OCT) to detect and localize faults without halting the operation of TSV-based 3D-IC systems. We first propose Statistical Detector, a method to detect open and short defects in TSVs that work in parallel with data transactions. Second, we propose an Isolation and Check algorithm to enhance the localization ability of the method. Moreover, the Monte-Carlo simulations show that the proposed Statistical Detector increases ×2 the number of detected faults when compared to conventional ECC-based techniques. With the help of Isolation and Check, TSV-OCT localizes the number of defects up to ×4 and ×5 higher. In addition, the response time is kept below 65,000 cycles which could be easily integrated into real-time applications. On the other hand, an implementation of TSV-OCT on a 3D Network-on-Chip router shows no performance degradation for testing while having a reasonable area overhead.

Item Type: Article
Subjects: Electronics and Communications
Electronics and Communications > Electronics and Computer Engineering
Scopus-indexed journals
ISI-indexed journals
Divisions: Key Laboratory for Smart Integrated Systems (SISLAB)
Depositing User: Khanh N. Dang
Date Deposited: 10 Jul 2020 14:57
Last Modified: 29 Jul 2020 08:39

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