Bui, Thanh Tung and Suzuki, Motohiro and Kato, Fumiki and Nemoto, Shunsuke and Watanabe, Naoki and Aoyagi, Masahiro (2013) Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration. Japanese Journal of Applied Physics, 52 (4S). 04CB08. ISSN 0021-4922
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Official URL: http://dx.doi.org/10.7567/JJAP.52.04CB08
| Item Type: | Article |
|---|---|
| Subjects: | Electronics and Communications Electronics and Communications > Electronics and Computer Engineering |
| Divisions: | Faculty of Electronics and Telecommunications (FET) |
| Depositing User: | Ms. Cam Le Tran Thi |
| Date Deposited: | 30 May 2016 05:41 |
| Last Modified: | 30 May 2016 05:42 |
| URI: | http://eprints.uet.vnu.edu.vn/eprints/id/eprint/837 |
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