Bui, Thanh Tung and Motohiro, Suzuki and Naoya, Watanabe and Katsuya, Kikuchi and Fumiki, Kato and Shunsuke, Nemoto and Aoyagi, Masahiro (2013) High Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects. In: International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices, July 2013, Zweibrucken, Germany.
Full text not available from this repository.| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Electronics and Communications Electronics and Communications > Electronics and Computer Engineering |
| Divisions: | Faculty of Electronics and Telecommunications (FET) |
| Depositing User: | Ms. Cam Le Tran Thi |
| Date Deposited: | 30 May 2016 05:44 |
| Last Modified: | 30 May 2016 05:45 |
| URI: | http://eprints.uet.vnu.edu.vn/eprints/id/eprint/840 |
Actions (login required)
 |
View Item |
