Bui, Thanh Tung and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) 15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications. In: International Conference on Solid State Devices and Materials, 2013, Fukuoka, Japan.
Full text not available from this repository.| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Electronics and Communications Electronics and Communications > Electronics and Computer Engineering |
| Divisions: | Faculty of Electronics and Telecommunications (FET) |
| Depositing User: | Ms. Cam Le Tran Thi |
| Date Deposited: | 30 May 2016 05:28 |
| Last Modified: | 30 May 2016 05:29 |
| URI: | http://eprints.uet.vnu.edu.vn/eprints/id/eprint/841 |
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