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15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications

Bui, Thanh Tung and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) 15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications. In: International Conference on Solid State Devices and Materials, 2013, Fukuoka, Japan.

Full text not available from this repository.
Item Type: Conference or Workshop Item (Paper)
Subjects: Electronics and Communications
Electronics and Communications > Electronics and Computer Engineering
Divisions: Faculty of Electronics and Telecommunications (FET)
Depositing User: Ms. Cam Le Tran Thi
Date Deposited: 30 May 2016 05:28
Last Modified: 30 May 2016 05:29
URI: http://eprints.uet.vnu.edu.vn/eprints/id/eprint/841

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