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Investigation of the applicability of parylene-HT as a dielectric layer for interconnections in 3D integration system

Bui, Thanh Tung and Watanabe, Naoya and Cheng, Xiaojin and Kato, Fumiki and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) Investigation of the applicability of parylene-HT as a dielectric layer for interconnections in 3D integration system. In: International Symposium on Frontiers of Materials Science, November 2013, Hanoi, Vietnam.

Full text not available from this repository.
Item Type: Conference or Workshop Item (Paper)
Subjects: Electronics and Communications
Electronics and Communications > Electronics and Computer Engineering
Divisions: Faculty of Electronics and Telecommunications (FET)
Depositing User: Ms. Cam Le Tran Thi
Date Deposited: 30 May 2016 05:45
Last Modified: 30 May 2016 05:46
URI: http://eprints.uet.vnu.edu.vn/eprints/id/eprint/842

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