Melamed, Samson and Hashino, Masaru and Fumiki, Kato and Shunsuke, Nemoto and Bui, Thanh Tung and Katsuya, Kikuchi and Hiroshi, Nakagawa (2013) Investigation of a Microchannel-based Cooling Interposer for High-Performance Memory-on-Logic 3DIC Designg. In: The 15th Electronics Packaging Technology Conference, 2013, Singapore.
Full text not available from this repository.| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Electronics and Communications Electronics and Communications > Electronics and Computer Engineering |
| Divisions: | Faculty of Electronics and Telecommunications (FET) |
| Depositing User: | Ms. Cam Le Tran Thi |
| Date Deposited: | 30 May 2016 07:00 |
| Last Modified: | 30 May 2016 07:00 |
| URI: | http://eprints.uet.vnu.edu.vn/eprints/id/eprint/844 |
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